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ÄÚÆÃ Á¢Âø·Â Æò°¡-´Ù±â´É ½ºÅ©·¹Ä¡½ÃÇè±â(Coating Adhesion Tester) |
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1.ÃøÁ¤¿ä¼Ò
Á¢Âø°µµ ÃøÁ¤¿ä¼Ò : -Scratch Hardness Test --->ÀÏÁ¤ÇÏÁßÇÏ¿¡¼ Scratch Resistnce/Micro Hardness ÃøÁ¤ -Scratch Adhesion Test --->ÇÏÁßÀ» Áõ°¡½ÃŰ¸ç ½ÃÇèÇϸç ÄÚÆÃÁ¢Âø·Â/Scratch Toughness ÃøÁ¤ -Delamination/Ahdesion -Friction/Wear/Deformation
¹°¼º ÃøÁ¤¿ä¼Ò : -NANO Hardness/NANO Indenting -Micro Hardness -Creep/Elastic Modulus/Youngs Modulus -Tensile/Compression -Penetration/Piercing Resistance. -Sharpness
¸¶Âû¸¶¸ðÀ±È°ÃøÁ¤¿ä¼Ò : -´Ù¾çÇÑ ÀçÁúÇ¥¸éÀÇ ¸¶Âû¸¶¸ðÀ±È°(TRIBOLOGY)Ư¼º ¹× ÄÚÆÃÆ¯¼º ÃøÁ¤ -Àü¹®ÀûÀΠȸÀü½Ä Pin on disc(0.1~5,000rpm) -¿Õº¹µ¿½Ä¸¶Âû¸¶¸ð(50Hz)/Block on Ring/Fourball -±¤µð½ºÅ©µîÀÇ TribologyƯ¼º -Hard DiskÇ¥¸éÀÇ ¸¶Âû°è¼ö¿Í ¿Æ¯¼º ½ÃÇè -CMP TEST
AFM/Optical Microscope ¿É¼Ç
´Ù¾çÇÑ Ä¡±¸¿Í ¼¾¼·Î ÇÑ °èÃø±â³»¿¡¼ À§¿Í °°Àº Nano~Micro~Macro´ÜÀ§ÀÇ ¹°¼º¹× Ç¥¸é,°è¸éƯ¼ºÀ» ¿Ïº®È÷ ºÐ¼®ÇÒ ¼ö ÀÖ´Â °í±â´É Àåºñ ÀÓ.
2.Ư¡
A. ADHESION(Á¢Âø·Â) ¼¼°èÃÖÃÊ·Î ÇÑ ½ÃÇè±â¿¡¼ ÄÚÆÃÀÇ Adhesion(Á¢Âø·Â)À» ½ÃÇèÇÏ´Â 5°¡Áö ¹æ½ÄÀÎ Tape test/Stud-Pull test/Scratch test/indentation test/¸éµµ³¯¿¡ ÀÇÇÑ ¹æ½ÄµîÀ» ¼öÇàÇÏ¿©, ¹Ú¸·°ú Èĸ·ÀÇ Á¢Âø·ÂÀ» Á¤È®ÇÏ°í ´Ù¾çÇÏ°Ô ÃøÁ¤ÇÑ´Ù. ¶ÇÇÑ, °í±Þ ÆòÆÇ À¯¸®/½ºÅ×Àη¹½º ½ºÆ¿ ½ÃÆ® ¹× Á¢ÂøÁ¦ÀÇ »ó´ë¹°Áú¿¡ ´ëÇÑ Á¢Âø·Â ½ÇÇèµµ ´Ù¾çÇÑ Áö±×¿¡ ÀÇÇØ °¡´É. ½Ã½ºÅÛÀÇ ÇÏÁßÁ¦¾î ¹æ½ÄÀÌ Closed Loop Servo Control SystemÀ¸·Î ÇÏÁß Àû¿ë½Ã, ½ÃÆí°ú ÇØ´çÇ¥¸é¿¡¼ ¹ß»ýµÇ´Â ½ÇÁ¦ ÇÏÁßÀ» Á¤È®È÷ Àоî ÁÖ¸ç, ´Ù½Ã Closed LoopÀ¸·Î Á¦¾îÇÏ°Ô µÇ¾î, ½ÇÁ¦ ½ÃÆíÀÌ SoftȤÀº Hard ÄÚÆÃ, º¼·Ï/¿À¸ñ/´Ù¾çÇÑ ÇüÅÂ¿Í »ó°ü¾øÀÌ ¿øÇÏ´Â ÇÏÁßÀû¿ëÀ» ¹þ¾î³ª·Á°í ÇÒ °æ¿ì ÀÌ Á¦¾î½Ã½ºÅÛÀº ½ÅÈ£¸¦ LoopÀ¸·Î ¿¬¼ÓÀûÀ¸·Î Á¤È®È÷ ÇÏÁßÁ¦¾î¸¦ ÇÏ°Ô µÇ¾î, Constant Load/Progressive load ¸ðµÎ Á¤È®È÷ ½ÃÆí¿¡ ÇÏÁßÁ¦¾î°¡ ÀÌ·ç¾îÁö°Ô µË´Ï´Ù. ´ëºÎºÐÀÇ À¯¸í Ÿ»ç ÀåºñµéÀº ÇÏÁßÁ¦¾î°¡ ½ÇÁ¦ Á¤È®ÇÏÁö ¾ÊÀº °æ¿ì°¡ ¸¹½À´Ï´Ù. º¸ÅëÀº ÀϹæÀûÀÎ ÇÏÁßÀû¿ë°ú OutputÃøÁ¤¹æ½ÄÀÔ´Ï´Ù
B. Scratch (½ºÅ©·¹Ä¡) Maker¿¡¼ Ư¼ö ¼³°èÇÑ Diamond Tip»Ó ¾Æ´Ï¶ó,Blade¸¦ ÀÌ¿ëÇÏ¿© ÇÏÁßÀ» Áõ°¡½Ã۸ç, ¹Ú¸· ¶Ç´Â Èĸ·À» ½ºÅ©·¹Ä¡ÇÏ¿© ÄÚÆÃÀ» ÆÄ±«ÇÑ blade°¡ Substrate¸¦ °¨ÁöÇÒ¶§ Àü±âÀúÇ×/Ç¥¸éÀúÇ× ¹× °íÀ½Çâ ŽÁö¿¡ ÀÇÇÏ¿©, Critical load¸¦ ºÐ¼®ÇÔ. µðÁöÅÐÄ«¸Þ¶ó¹× Çö¹Ì°æ ¿É¼Ç. ÀÌ Àåºñ´Â ¼ÒÇÁÆ® ÄÚÆÃÀç·á ȤÀº Ç¥¸éÀÌ º¼·Ï/¿À¸ñÇÑ Æ¯ÀÌÇÑ Çü»óÀÇ Ç¥¸éÀçÁúÀÇ °æ¿ì ±âÁ¸ÀÇ À¯¸íµµ°¡ ³ôÀº ½ºÅ©·¹Ä¡ ½ÃÇè±âµµ µ¥ÀÌÅͰ¡ ¸Å¿ì ºÒ¾ÈÁ¤ÇØÁö³ª, Ư¼öÇÑ ÇÏÁßÁ¦¾î ½Ã½ºÅÛÀ» µµÀÔÇÏ¿©, ÀÌ·¯ÇÑ ´ÜÁ¡À» ¿ÏÀüÈ÷ Á¦°ÅÇÑ ÃֽŠÀåºñÀÓ.
C. Micro Hardness/Micro Indenting(¸¶ÀÌÅ©·Î °æµµ/¹°¼º) ´Ù¾çÇÑ ¾ÐÀÚ¸¦ 1OOkg~0.01gram(ºÐÇØ´É:0.0005gf/ Accuracy:0.001gf)ÀÇ ¼¾¼¸¦ ¼±Á¤ÇÏ¿© ÇÏÁßÀ» Á¤±³È÷ Á¶Á¤ÇÏ¿©, Indentingº¯À§ 30nmºÐÇØ´ÉÀ¸·Î ÃøÁ¤¹üÀ§ 30nm~micron meter~milli meter ÃøÁ¤ºÐ¼®.´Ù¾çÇÑ ¹°¼ºÄ¡ÀÎ Creep/Relaxation/Youngs Modulusµî ÃøÁ¤ ¹× ÇÑ ½ÃÆí¿¡¼ ¼ö½Ê°³ÀÇ ¾ÐÁ¡À» Âï¾î ½ÃÆíÀÇ ¹°¼ºÄ¡ÀÇ ±ÕÀϼº ºÐ¼®.
´Ù¸¥ ŸÀÔÀÇ ÃÊ ¹Ì¼Ò°æµµ±â »çÀÌÆ®
D. NANO Hardness/Nano Indenting(³ª³ë °æµµ/¹°¼º) Micro Á¦¾î ½Ã½ºÅÛ¿¡ »õ·Î¿î Nano ¹°¼ºÁ¦¾î½Ã½ºÅÛ Ãß°¡, ±âÁ¸ÀÇ Nano¹°¼º½ÃÇè¿ë ÇÏÁßÁ¦¾î½Ã½ºÅÛÀÇ Voice Coil Linear Actuator¿Í 3-Plate Capacitive Sensor¸¦ Çõ½ÅÇÏ¿© ÀçÇö¼º¿¡ ´ëÇÑ ¾ÈÁ¤¼º Çâ»ó. Vertical Stroke-150 micron; Displacement resolution-0.4 nm; Displacement noise floor: 1 nm; Force Control Range : 5gram ~ 5 x 10-7gram Force noise floor: 10nN ¿É¼ÇÃß°¡ »çÇ×À¸·Î NANO INDENTING SYSTEM¿¡ AFMÃøÁ¤ÀåÄ¡ Ãß°¡ °¡´É.
SPM MODULE- In Air: Contact AFM / LFM / ResonantMode AFM (semicontact+noncontact) AFM / Phase Imaging(Options: Force Modulation(viscoelastisity)/ Adhesion force imaging / Spreading Resistance Imaging / SCM / SKM / MFM / EFM / FM Voltage, Lithography:local probe oxidation,nanoscratching )
In Liquid: (Options:Contact AFM / LFM / ResonantMode AFM (semicontact+noncontact)/ Phase Imaging / Force Modulation(viscoelastisity)/ Adhesion force imaging )
- Small samples (up to 100X100X20 mm ) can be tested - Scanners: 50X50X2.5 (+/-10%) micron; 90X90X5 (+/-10%) micron (option) - Min. Scanning Step(Z): 0.006 nm; 0.012 nm (option if 90X90X5 micron Scanner) - Lateral Resolution : 1~3 nano meter - Scan type: by probe - Sample positioning range : 5X5 mm - Positioning resolution: 5 micron - Optical viewing system:Numerical aperture 0.1/ Magnification: 50X/ Horizontal field of view: 0.5 mm - Control system: SPM controller
E. Friction/Wear (¸¶Âû/¸¶¸ð/À±È°/³»±¸¼º ¼ö¸íÆò°¡) Áö±×¿Í ÀûÁ¤¼¾¼ÀÇ º¯Çü¿¡ µû¶ó, ÇÑ ½ÃÇè±â¿¡¼ 0.01gram-200kgÇÏÁßÀ» Á¤±³È÷ Á¶Á¤°¡´ÉÇϸç, Çɿµð½ºÅ©,¿Õº¹µ¿½Ä,Block on Ring,Four BallµîÀÇ ½ÇÇèÀ» °í¿Â,Áø°ø,ºÎ½Ä¼º °³½º¹× ´Ù¾ç ÇÑ ºÐÀ§±â¸¦ Á¶¼ºÇÏ¿© ½ÇÇèÀ» Çϴ ȹ±âÀûÀÎ ÀåºñÀÓ. ¶ÇÇÑ Çϵåµð½ºÅ© ¹× DVD/CD-R/CD-RW µîÀÇ ÄÚÆÃ ¹× ¹ÝµµÃ¼ WAFERÀÇ °øÁ¤¿¡¼ Ç¥¸éÀÇ ¿º¯Çü ¹× ¸¶Âû,¸¶¸ðÀ²,À±È°,¿¬¸¶Æ¯¼ºµîÀ» Á¤±³È÷ ºÐ¼®ÇÔ.
¾Æ·¡ ½ÇÇè DATA SHEET ÂüÁ¶ ÇϽñ⠹ٶø´Ï´Ù.!!!
F. Creep(ÀÏÁ¤ÇÑ ÇÏÁß¿¡ ´ëÇÑ,±Ý¼ÓÀÇ º¯ÇüÀ²) ź¼º¹°ÁúÀ̳ª ƯÁ¤ Àç·á¹× ±â±¸¸¦ ÀÏÁ¤ÇÑ ÇÏÁßÀ» °¡ÇÏ¿© ´ë»ó¹°ÁúÀÇ º¯ÇüÀ² À» ÃøÁ¤Çϸç, ¹Ý´ëÀÇ ¼ºÁúÀÎ ÀÏÁ¤ÇÑ º¯Çü¿¡ ´ëÇÑ ÇÏÁßÀÇ º¯ÈÄ¡ÀÎ Relaxation¿¡ ´ëÇÑ ÃøÁ¤.
G. Tensile( ÀÎÀå, ¾ÐÃà) Video/Audio/Magnetic Tape¸¦ ÀÎÀå½ÃÇè±â¿Í °°ÀÌ Àû¿ëµÈ ÀÎÀå·Â¿¡ ´ëÇÑ Åº¼ºÀ² ¹× º¯Çü·üÀ» ºÐ¼®. CANTILEVER¿Í °°Àº MEMSÀÇ ±â°èÀûƯ¼º(Elastic Modulus/Internal Stress/Stiffness) ¹× Ç¥¸éƯ¼º ½ÇÇè¿¡ ÀûÇÕ.
3.Àû¿ë¹üÀ§
A.¹Ú¸· Èĸ· µî ´Ù¾çÇÑ ÄÚÆÃ¹× ÀçÁúÀÇ Á¢Âø·Â Æò°¡, Delamination, ½ºÅ©·¹Ä¡ ÀúÇ×¼º Æò°¡ B.LCD/PDP DisplayÀÇ ITO ÄÚÆÃ°ú °°Àº Ãʹڸ·ÀÇ Á¢ÂøÆ¯¼º Æò°¡. C.Ãʹڸ· µî ³ª¸ð¹°¼º Æò°¡ D.MEMS(Micro Electronic Machine SystemÀÇ ¹°¼º) -Cantilevar¿Í °°Àº MEMS±¸Á¶¹°ÀÇ Young's Modulus, Internal Stressµî ÃøÁ¤ C.±¤µð½ºÅ©(DVD,CD-R/RW),¸¶±×³×ƽ Çìµå/¸¶±×Åׯ½
Å×ÀÌÇÁ,MediaÀÇ ¹°¼º ¹× Ç¥¸é ¸¶Âû¸¶¸ðƯ¼º E.ÀÇ·á¿ë ¼ö¼ú tool, needle,suture,ballon F.À¯¸®, ¾È°æ·»Áî, Á¾ÀÌÀÇ ÄÚÆÃÁ¢Âø·Â Æò°¡, G.À±È°À¯ Ư¼º H.ÄÚÆÃÀÇ °üÅëÀ², I.¸éµµ³¯µîÀÇ Sharpness ¹× ³»¸¶¸ðµµ Æò°¡. H.¹ÝµµÃ¼ ¿þÀÌÆÛ ÄÚÆÃ ±â¼ú ¹× CMP TESTER -º°µµ·Î CMP Tester ¹× Control Device¸¦ °ø±Þ(»ç¿ëÀÚ :Applied Material, Speed Fam/IPEC, Rodel,IBM..µî)
4.¼¼ºÎ »ç¾ç
´Ù¾çÇÑ ¹üÀ§ÀÇ ÃÊÁ¤¹Ð¼¾¼¸¦ Çʿ信 µû¶ó ÃßÈÄ ±¸¸Å Àû¿ë °¡´É. -ÃÖ¼Ò ¼öÁ÷ ÇÏÁßÁ¦¾î : 0.01g-1gf(Á¦¾î¹× ÃøÁ¤) -Nano Indenter ¿ë ÃÖ¼Ò¼öÁ÷ÇÏÁßÁ¦¾î : 5 x 10-7gramf -ÃÖ¼Ò ¼öÁ÷ÇÏÁß ºÐÇØ´É : 0.0005gf -ÃÖ´ëÀû¿ëÇÏÁß : Over 200kg(Áö±×º¯È¯) ±¤¹üÀ§ÇÑ ¿ëµµ Àû¿ë. -¼öÁ÷ º¯À§ ÃÖ¼Ò ºÐÇØ´É: 30nm, 0.5micron meter µÎ°¡Áö -Nano Indenter¿ë ¼öÁ÷º¯À§ ºÐÇØ´É: 0.4nano meter -ȸÀü½Ä ¸¶ÂûȸÀü ¼Óµµ : 0.001~12,000rpm -¿Õº¹µ¿½Ä Ãִ븶Âû¼Óµµ: 50Hz -X,Y,ZÃà ¿îµ¿ ¹× ¼ÓµµÁ¶Àý. -Àڻ簳¹ß¼¾¼ : 2 Axis Friction/Load ¼¾¼ Strain gauge sensor Capacitance wear/deformation sensor Electrical Resistance Sensor(ECR)/ESR High Frequency Acoustic Sensor ¸¸´É¿¡ °¡±î¿î ½ÃÇ豸ÇöÀ» À§ÇÑ ´Ù¾çÇÑ Áö±×
ÀÌ °èÃø±âÀÇ Çõ½ÅÀû Á¦¾î ¹× ¼¾¼ ¿ø¸®¸¦ ¾Ë°í½ÍÀ¸½Ã¸é ¿¬¶ôÁֽñ⠹ٶø´Ï´Ù | |
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CETR »çÀÇ TribologistÀÎ Dr. Norm Gitis°¡ ¸ðµ¨ UMTÀÇ Àç·á¹× ÄÚÆÃ¿¡ ´ëÇÑ ÃÑüÀûÀÎ ½ÃÇèºÐ¼® ¼öÇàÀÌ ¾î¶² ¿ø¸®·Î °¡´ÉÇÑÁö¿¡ ´ëÇÑ PresentationÀÔ´Ï´Ù.°¡Áö°í °è½Å ȸ¼± ¼Óµµ¿¡ ¸Â´Â °ÍÀ» ¼±ÅÃÇϽþî Ŭ¸¯Çϼ¼¿ä. | |
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°ü·Ã ½ÇÇè DATA LIST (ÇÊ¿äÇϽŠÀÚ·á°¡ ¾øÀ¸½Å °æ¿ì ¿¬¶ô ¹Ù¶ø´Ï´Ù.) -Adhesion testing of Thin coatings( PDF file, 243 Kb) -Adhesion & Delamination-Multisensor for thin & thick coating( PDF file, 60k) -Overcoat duability for MEMS ( PDF file, 318 Kb) for Ultra
thin Diamond Like Carbon Film. -ÄÚ´× Glass Ç¥¸éÀÇ Á¢Âø·Â ½ÃÇè ( PDF file, 197 Kb ) -·»Áî¹× Glass ÄÚÆÃ¿¡ ´ëÇÑ Scratch/Á¢Âø·Â ½ÃÇè ( PDF file, 197 Kb) | |
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-Pull-off force (vertical stiction) test Testing
Method ( PDF file, 82Kb) | |
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-Mechanical Tester for Bio-Medical
Materials and Devices( PDF file, 725Kb) -One finger & Three Finger Connector Test(PDF file, 1460 Kb) | |
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-NANO Hardenss + AFM ÃøÁ¤ ( PDF file, 758 Kb) -NANO Hardeness +SPM( PDF file, 158 Kb) -Micro/Nano Hardness Test( PDF file, 74 Kb)
-°è¼ÓÇØ¼ »õ·Î¿î ÀÚ·á Áغñ Áß ÀÔ´Ï´Ù. | |
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ÀüÈ : 02 - 3411- 0173 ÆÑ½º : 02 - 3411 - 0178
2001-2005
Hanmi Industries Ltd. All rights reserved | |