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     ¸ðµ¨ TRIRCI    

      Short Coherence Transmitted Light Interferometer for theThickness Measurement of Si Membranes

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 1.¿þÀÌÆÛ µÎ²² ÃøÁ¤±â(TTV=Total Thickness Variation)

 2.Si Membrance, MEMS, Transparent Thin MaterialsÀÇ µÎ²² ÃøÁ¤±â

 3.Roughness/Flatness/Waviness/Saw Mark/¿¬¸¶°á/WARPAGE/Ç¥¸é °áÇÔ µî ÃøÁ¤,

 4.¿É¼Ç, Ç¥¸éÀÇ 2Â÷¿ø 3Â÷¿ø ÃøÁ¤

                                                                   Ellipsometer(°í¼Ó ¹Ú¸· µÎ²²ÃøÁ¤±â) 

                                                                                           °í¼Ó TTV,¸ðÀçµÎ²²,ºñƲ¸²,Æòźµµ,¹Ú¸·ÀÇ ÀÀ·Â,Ç¥¸é¾ç¸é3Â÷¿ø ÃøÁ¤±â  

                                                                                                             ´Ù¾çÇÑ Å¸ÀÔÀÇ 2,3Â÷¿ø ÃøÁ¤±â       

 

¸ðµ¨ TRIRCI   ¿þÀÌÆÛµÎ²²ÃøÁ¤±â

-Technical Data-

 

 1.Thickness resolution           [µm]            < 0.01

 2.Probing footprint approx.      [µm]            150  (smaller on                                                                  request)

 3.Thickness range, approx.     [µm]            5 - 600

 4.Dimensions, approx.             [mm]           320 x 320 x 380

 5.Weight                             [kg]              120

 6.Wafer fixture acc. to customer¡¯s requirements upto 8¡± Fully    automated measurement, Standard or customized software    package

    

                                                                                                       

          

     

The TRIRCI is a measurement device for non contact thickness measurement of Si beams. It lends itself for the

use in the laboratory, work shop and the quality assurance in a production line.

The measurement head offers unparalleled repeatability and has a robust and compact design. It is maintenance

free and therefore suitable for an in-line process.

The thickness of Si membranes is determined within a few seconds and an automated procedure allows easy checking

of whole wafers.

The TRIRCI is capable to cover a wide range of thickness values, starting from 200 nm up to almost 1mm using a footprint

of the probing beam of approximately 150µm. The instrument employs a unique infrared measurement technique different from

the ordinary white light interferometers. No use is made from light beams reflected from the sample surfaces. This ensures

a very high stability and repeatability of the measurement data.

The motorized stages allow measuring the thickness profile along a silicon beam. One can measure etched individual

silicon beams or membranes on a wafer on a statistical basis. To this end measurement locations are defined in a table.

They can be entered using X, Y coordinates or under visual control with the help of the integrated camera. As an option

one can also measure the lateral dimensions of a silicon beam.

The measurement system comprises of the optical measurement head, a stable granite stand with X and Y motorised stages,

the wafer holder, a PC and the customised software. It runs under Windows XP

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ÀüÈ­ :  02 - 3411- 0173    ÆÑ½º :  02 - 3411 - 0178  

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