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¸ðµ¨ TRIRCI Short Coherence Transmitted Light Interferometer for theThickness Measurement of Si Membranes ÀüÀÚµ¿, ¿þÀÌÆÛ È¤Àº ÃøÁ¤´ë»ó¹°ÀÇ ÀÚµ¿ ½ÃÆí ÀåÂø->ÃøÁ¤->ºÐ¼®. 1.¿þÀÌÆÛ µÎ²² ÃøÁ¤±â(TTV=Total Thickness Variation) 2.Si Membrance, MEMS, Transparent Thin MaterialsÀÇ µÎ²² ÃøÁ¤±â 3.Roughness/Flatness/Waviness/Saw Mark/¿¬¸¶°á/WARPAGE/Ç¥¸é °áÇÔ µî ÃøÁ¤, 4.¿É¼Ç, Ç¥¸éÀÇ 2Â÷¿ø 3Â÷¿ø ÃøÁ¤ Ellipsometer(°í¼Ó ¹Ú¸· µÎ²²ÃøÁ¤±â) °í¼Ó TTV,¸ðÀçµÎ²²,ºñƲ¸²,Æòźµµ,¹Ú¸·ÀÇ ÀÀ·Â,Ç¥¸é¾ç¸é3Â÷¿ø ÃøÁ¤±â
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¸ðµ¨ TRIRCI ¿þÀÌÆÛµÎ²²ÃøÁ¤±â |
-Technical Data-
1.Thickness resolution [µm] < 0.01 2.Probing footprint approx. [µm] 150 (smaller on request) 3.Thickness range, approx. [µm] 5 - 600 4.Dimensions, approx. [mm] 320 x 320 x 380 5.Weight [kg] 120 6.Wafer fixture acc. to customer¡¯s requirements upto 8¡± Fully automated measurement, Standard or customized software package |
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The TRIRCI is a measurement device for non contact thickness measurement of Si beams. It lends itself for the use in the laboratory, work shop and the quality assurance in a production line. The measurement head offers unparalleled repeatability and has a robust and compact design. It is maintenance free and therefore suitable for an in-line process. The thickness of Si membranes is determined within a few seconds and an automated procedure allows easy checking of whole wafers. The TRIRCI is capable to cover a wide range of thickness values, starting from 200 nm up to almost 1mm using a footprint of the probing beam of approximately 150µm. The instrument employs a unique infrared measurement technique different from the ordinary white light interferometers. No use is made from light beams reflected from the sample surfaces. This ensures a very high stability and repeatability of the measurement data. The motorized stages allow measuring the thickness profile along a silicon beam. One can measure etched individual silicon beams or membranes on a wafer on a statistical basis. To this end measurement locations are defined in a table. They can be entered using X, Y coordinates or under visual control with the help of the integrated camera. As an option one can also measure the lateral dimensions of a silicon beam. The measurement system comprises of the optical measurement head, a stable granite stand with X and Y motorised stages, the wafer holder, a PC and the customised software. It runs under Windows XP | |
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ÀüÈ : 02 - 3411- 0173 ÆÑ½º : 02 - 3411 - 0178
2001-2005
Hanmi Industries Ltd. All rights reserved |
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